Press Release

11th December, 2001 - San Francisco

Adamya Technologies and Tensilica Announce Sub $5 Bluetooth Functionality

Solution Optimized for Low Cost and Power Requirements of Consumer Devices Adamya Technologies, Inc., a leader in wireless and DSP system development, and Tensilica Inc., the leading supplier of configurable processor cores for embedded system-on-chip (SOC) applications, jointly announce the availability of the C-Blue(TM) Bluetooth application solution package for Tensilica's Xtensa(TM) configurable microprocessor architecture. This solution enables designers to incorporate Bluetooth functionality into their end systems and systems-on-chip (SOCs). 

The Bluetooth 1.1 compliant software baseband and stack was developed through the combination of special hardware to accelerate the baseband and protocol functions created in the Tensilica Instruction Extension (``TIE'') language, and an optimized implementation of the Adamya's Bluetooth software that utilizes the special hardware.

Traditionally Bluetooth solutions have been developed utilizing either standard products or dedicated hardwired logic in ASICs. The standard product approach requires dedicated components that add significant cost and consume valuable printed circuit board real estate. The use of hardwired logic in ASICs creates integration and verification challenges with a resulting increase in development time. By contrast, the Xtensa C-Blue package is a processor-based solution that facilitates SOC integration and simplified verification through standard software development tools.

Key Features and Benefits: 
The use of TIE customized hardware instructions results in an extremely efficient implementation that requires an average of only 8 MHz to run both the baseband and protocol stack functions. Combined with other application solution packages such as the Dolby Digital (AC-3) and MP3 audio decoders, highly-integrated, cost effective SOCs for consumer applications (digital imaging; set top boxes, wireless handsets and PDAs) can be quickly developed. Designers can now meet the critical sub $5 cost point in their SOC designs through utilizing the Xtensa C-Blue package in conjunction with an external Blue RF compliant radio.

``Low cost and power are the key factors in developing Bluetooth products,'' stated Bernie Rosenthal, Tensilica's senior vice president of marketing and business development. ``By exploiting the configurability and extensibility of the Xtensa architecture, Adamya has been able to create an exceptional Bluetooth package that delivers on both. Tensilica's customers will benefit from a processor based Bluetooth solution that can be combined with other Xtensa based functions to create highly integrated and differentiated SOC designs while meeting demanding cost and time to market demands.''

``We are excited to be partnered with Tensilica to create an optimized version of our Bluetooth Solutions suite on the Xtensa processor. It makes possible a huge array of Bluetooth products in segments including Consumer Electronics, Human Interface devices, and computer peripherals. These segments can now benefit from low power and cost through SOC integration with this combination,'' said Vikas Gurugunti, Adamya's senior vice president of strategic partnerships.

Additionally, Adamya has joined the Tensilica Xtensions(TM) Network third-party partnership program as an Application Software partner. The mission of the Xtensions Network is to assemble and make available a broad spectrum of ``best-in-class technologies'' to Xtensa technology users. To date, the Xtensions Network numbers 24 partners, including real-time operating system (RTOS) companies, vertical-market application software specialists, and design services firms providing a solution-rich range of products and services that support Tensilica's robust processor ecosystem.